Computed tomography

Technical specifications

  • X-ray source: maximum voltage/power 180 kV/15 W
  • Target: Tungsten on beryllium or molybdenum
  • Geometric magnification: 1.7× – 250×
  • Resolution: up to 200 nm (0.2 µm)
  • Minimum voxel size: up to 500 nm (0.5 µm)
  • Detector: High-Contrast Detector HCD 120-50, 12-bit/16-bit, 3-fold measurement range extension (max. 6,900-pixel detector width)
  • Pixels: 2,300 x 2,300
  • Pixel size: 50 µm
  • Max. sample diameter: < 1 mm to 120 mm

Applications of CT

  • Insights into objects and assemblies
  • Damage analysis
  • Checking connections
  • Dimensional measurement technology
  • Volume analysis
  • Target versus actual comparisons
  • Detection of defects, e.g. cavities, pores or foreign particles
  • Determining precise information about shape and position

Insights into objects and assemblies

Damage analysis

Coil with a break in the wire
Dimensioning a workpiece

Cross-section preparation technique

Technology

  • Prototype manufacturing using thick-film hybrid technology
  • Shear and tensile tests for test series
  • Replacement of components on printed circuit boards
  • Thick-wire and thin-wire bonding for experimental purposes
  • Flip-chip bonding
  • Training courses

Mishmash

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Head of Laboratory

Prof. Dr. Gregor Feiertag Room: R 2.047

T +49 89 1265-3463

Email

Laboratory supervision

Armin Hadzimujic Room: R BG.002

T +49 89 1265-3491

Email

Thomas Schalk Room: R 2.046

T +49 89 1265-3444

Email